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FS6128-04G-XTP Datasheet(PDF) 4 Page - ON Semiconductor |
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FS6128-04G-XTP Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 6 page FS6128-04 Table 5: DC Electrical Specifications Parameter Symbol Conditions/Descriptions Min. Typ. Max. Units Overall Supply current, dynamic, with loaded outputs IDD fXAL = 13.5MHz; CL = 10pF; VDD = 3.6V 30 mA Supply current, static IDD XIN = 0V; VDD = 3.6V 3 mA Voltage-Controlled Crystal Oscillator (contact factory for approved crystal sources or other application assistance) Crystal loading capacitance at center tuning voltage CL(xtal) Order crystal for this capacitance (parallel load) at desired center frequency 14 pF Crystal resonator motional capacitance C1 Specified motional capacitance of the crystal will affect pullability (see text) 25 fF XTUNE effective range 0 3 V Synthesized load capacitance min. CL1 @V(XTUNE) = minimum value 10 pF Synthesized load capacitance max. CL2 @V(XTUNE) = maximum value 20 pF VCXO tuning range fXTAL = 13.5MHz; CL(xtal) = 14pF; C1(xtal) = 25fF (peak-to-peak) 300 ppm VCXO tuning characteristic Note: positive change of XTUNE = positive change of VCXO frequency 150 ppm/V Crystal drive level RXTAL = 20Ω; CL = 20pF 200 μW Clock Output (CLK) High-level output source current* IOH VO = 2.0V -40 mA Low-level output sink current* IOL VO = 0.4V 17 mA Output impedance* ZOH ZOL VO = 0.1VDD; output driving high VO = 0.1VDD; output driving low 25 25 Ω Short circuit source current* IOSH VO = 0V; shorted for 30s, max. -55 mA Short circuit sink current* IOSL VO = 3.3V; shorted for 30s, max. 55 mA Note: Unless otherwise stated VDD = 3.3V ±10% no load on any output and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk (*) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ±3σ from typical. Negative currents indicate current flows out of the device. Table 6: AC Timing Specifications Parameter Symbol Conditions/Descriptions Min. Typ. Max. Units Overall VCXO stabilization time* tVCXOSTB From power valid 10 ms PLL stabilization time* tPLLSTB From VCXO stable 100 μs Synthesis error (Unless otherwise noted in frequency table) 0 ppm Clock Output (CLK) Duty cycle* Ratio of high pulse width (as measured from rising edge to next falling edge at VDD/2) to one clock period 45 55 % Jitter, period (peak-peak)* tj(ΔP) From rising edge to next rising edge at VDD/2, CL = 10pF 200 ps 200 ps Jitter, long term (σ γ(τ) tj(LT) From 0-500μs at VDD/2, CL = 10pF compared to ideal clock source 100 ps Rise time* tr VDD = 3.3V; VO = 0.3V to 3.0V; CL = 10pF 1.7 ns Fall time* tf VDD = 3.3V; VO = 3.0V to 0.3V; CL = 10pF 1.7 ns Note: Unless otherwise stated, VDD = 3.3V ±10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk (*) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ±3σ from typical. Rev. 2 | Page 4 of 6 | www.onsemi.com |
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