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CM6100 Datasheet(PDF) 5 Page - ON Semiconductor |
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CM6100 Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 6 page CM6100 Rev. 6 | Page 5 of 6 | www.onsemi.com Vertical Structure Specification* Figure 1. Sectional View * Daisy Chain CM6000 Vertical Structure Dimensions (nominal) REF. Parameter Material Dimension a Die Thickness Silicon 396 μm h Repassivation Polyimide 10 μm Plated Cu 5.0 μm Sputtered Cu 0.4 μm d UBM-(Ti/Cu) Sputtered Ti 0.1 μm e UBM Wetting Area Diameter 240 μm b Bump Standoff 194 μm f Solder Bump Diameter after Bump Reflow 270 μm c Metal Pad Height AlSiCu 1.5 μm g Metal Pad Diameter 310 μm D2 0.406mm D1 Finished Thickness 0.600mm |
Similar Part No. - CM6100 |
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Similar Description - CM6100 |
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