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CM6100 Datasheet(PDF) 5 Page - ON Semiconductor

Part # CM6100
Description  0.4mm Pitch Daisy Chain
Download  6 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CM6100 Datasheet(HTML) 5 Page - ON Semiconductor

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CM6100
Rev. 6 | Page 5 of 6 | www.onsemi.com
Vertical Structure Specification*
Figure 1. Sectional View
* Daisy Chain CM6000
Vertical Structure Dimensions (nominal)
REF.
Parameter
Material
Dimension
a
Die Thickness
Silicon
396
μm
h
Repassivation
Polyimide
10
μm
Plated Cu
5.0
μm
Sputtered Cu
0.4
μm
d
UBM-(Ti/Cu)
Sputtered Ti
0.1
μm
e
UBM Wetting Area
Diameter
240
μm
b
Bump Standoff
194
μm
f
Solder Bump
Diameter after
Bump Reflow
270
μm
c
Metal Pad Height
AlSiCu
1.5
μm
g
Metal Pad Diameter
310
μm
D2
0.406mm
D1
Finished Thickness
0.600mm


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