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CM1453-08CP Datasheet(PDF) 11 Page - ON Semiconductor |
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CM1453-08CP Datasheet(HTML) 11 Page - ON Semiconductor |
11 / 12 page CM1453-08CP Rev. 2 | Page 11 of 12 | www.onsemi.com Mechanical Specifications CM1453 devices are packaged in custom Chip Scale Packages (CSP). See Application Note AP-217 for more information at: http://www.wlcspforum.org/documents/pdf/ap-217.pdf. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.229 3.274 3.319 0.1271 0.1289 0.1307 A2 1.099 1.144 1.189 0.0433 0.0450 0.0468 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 C1 0.187 0.237 0.287 0.0074 0.0093 0.0113 C2 0.175 0.225 0.275 0.0069 0.0089 0.0108 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces Controlling dimension: millimeters Package Dimensions for CM1453-08CP Chip Scale Package |
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