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CM1426-08CP Datasheet(PDF) 11 Page - ON Semiconductor |
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CM1426-08CP Datasheet(HTML) 11 Page - ON Semiconductor |
11 / 17 page CM1426 Rev. 2 | Page 11 of 17 | www.onsemi.com Mechanical Details CSP Mechanical Specifications CM1426 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. CM1426-04 Mechanical Specifications Package dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Millimeters Inches Dim Min Nom Max Min Nom Max A1 1.915 1.960 2.005 0.0754 0.0772 0.0789 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces Controlling dimension: millimeters Package Dimensions for CM1426-04 Chip Scale Package |
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