CM1426

Rev. 2 | Page 11 of 17 | www.onsemi.com

Mechanical Details

CSP Mechanical Specifications

CM1426 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For

complete information on CSP packaging, see the California Micro Devices CSP Package Information

document.

CM1426-04 Mechanical Specifications

Package dimensions are presented below.

PACKAGE DIMENSIONS

Package

Custom CSP

Bumps

10

Millimeters

Inches

Dim

Min

Nom

Max

Min

Nom

Max

A1

1.915

1.960

2.005

0.0754 0.0772 0.0789

A2

1.285

1.330

1.375

0.0506 0.0524 0.0541

B1

0.495

0.500

0.505

0.0195 0.0197 0.0199

B2

0.245

0.250

0.255

0.0096 0.0098 0.0100

B3

0.430

0.435

0.440

0.0169 0.0171 0.0173

B4

0.430

0.435

0.440

0.0169 0.0171 0.0173

C1

0.180

0.230

0.280

0.0071 0.0091 0.0110

C2

0.180

0.230

0.280

0.0071

0.091

0.0110

D1

0.575

0.644

0.714

0.0226 0.0254 0.0281

D2

0.368

0.419

0.470

0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Package Dimensions for CM1426-04

Chip Scale Package