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CAT6217-180TDGT3 Datasheet(PDF) 2 Page - ON Semiconductor

Part # CAT6217-180TDGT3
Description  150 mA CMOS LDO Regulator
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CAT6217-180TDGT3 Datasheet(HTML) 2 Page - ON Semiconductor

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Figure 1. Typical Application Circuit
VIN
BYP
EN
VOUT
GND
OFF ON
1 μF
2.3 V
to 5.5 V
1 μF
10 nF
CAT6217
Figure 2. CAT6217 Functional Block Diagram
BYP
EN
GND
VIN
VOUT
Shutdown
Switch
LDO
Reference
CIN
VIN
VOUT
COUT
CBYP (Optional)
VIN
VOUT
Pin Function
VIN is the supply pin for the LDO. A small 1
mF ceramic
bypass capacitor is required between the VIN pin and ground
near the device. When using longer connections to the power
supply, CIN value can be increased without limit. The
operating input voltage range is from 2.3 V to 5.5 V.
EN is the enable control logic (active high) for the regulator
output. It has a 2.5 M
W pull−down resistor, which assures
that if EN pin is left open, the circuit is disabled.
VOUT is the LDO regulator output. A small 1
mF ceramic
bypass capacitor is required between the VOUT pin and
ground for stability. For better transient response, its value
can be increased to 4.7
mF.
The capacitor should be located near the device. ESR
domain is 5 m
W to 500 mW. VOUT can deliver a maximum
guaranteed current of 150 mA. A 250
W internal shutdown
switch discharges the output capacitor in the no−load
condition.
GND is the ground reference for the LDO. The pin must be
connected to the ground plane on the PCB.
BYP is the reference bypass pin. An optional 0.01
mF
capacitor can be connected between BYP pin and GND to
reduce the output noise and enhance the PSRR at high
frequency.
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
VIN
0 to 6.5
V
VEN, VOUT
−0.3 to VIN + 0.3
V
Junction Temperature, TJ
+150
_C
Power Dissipation, PD
Internally Limited (Note 1)
mW
Storage Temperature Range, TS
−65 to +150
_C
Lead Temperature (soldering, 5 sec.)
260
_C
ESD Rating (Human Body Model)
3
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 2. RECOMMENDED OPERATING CONDITIONS (Note 2)
Parameter
Range
Unit
VIN
2.3 to 5.5
V
VEN
0 to VIN
V
Junction Temperature Range, TJ
−40 to +125
_C
Package Thermal Resistance (SOT23−5), θJA
235
_C/W
NOTE: Typical application circuit with external components is shown above.
1. The maximum allowable power dissipation at any TA (ambient temperature) is PDmax = (TJmax − TA)/qJA. Exceeding the maximum allowable
power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.
2. The device is not guaranteed to work outside its operating rating.


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