108-98003 Rev. G

All specifications subject to change. Consult Tyco Electronics for latest specifications.

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Telecom-, Signal and RF Relays

FX2 Relay

AXICOM

Insulation

Standard Version

High Dielectric Version

Insulation resistance at 500 Vdc

Dielectric test voltage (1 min)

between coil and contacts

between adjacent contact sets

between open contacts

1800 Vrms

1800 Vrms

1800 Vrms

4000 Vrms

1500 Vrms

1500 Vrms

Surge voltage resistance

according to Telcordia GR 1089 (2 / 10 µs)

between coil and contacts

between adjacent contact sets

between open contacts

according to FCC 68 (10 / 160 µs) and IEC (10 / 700 µs)

between coil and contacts

between adjacent contact sets

between open contacts

3500 V

2500 V

2500 V

3500 V

2500 V

2500 V

6000 V

2000 V

2000 V

6000 V

2000 V

2000 V

High Frequency Data

Capacitance

between coil and contacts

between adjacent contact sets

between open contacts

max. 4 pF

max. 2 pF

max. 2 pF

RF Characteristics

Isolation at 100 MHz / 900 MHz

Insertion loss at 100 MHz / 900 MHz

V.S.W.R. at 100 MHz / 900 MHz

- 34.0 dB / - 15.1 dB

- 0.03 dB / - 0.60 dB

1.07 / 1.45

General Data

Operate time at Unom typ. / max.

3 ms / 4 ms

Reset time (latching) atUnom , typ. / max.

3 ms / 4 ms

Duration of set / reset pulse (latching) min.

20ms*

Release time without diode in parallel (non-latching), typ. / max.

1 ms / 3 ms

Release time with diode in parallel (non-latching), typ. / max.

3 ms / 4 ms

Bounce time at closing contact, typ. / max.

1 ms / 5 ms

Maximum switching rate without load

50 operations/s

Ambient temperature

-55 °C ... +85 °C

Thermal resistance

< 165 K/W

Maximum permissible coil temperature

125 °C

Vibration resistance (function)

20 G 10 to 500 Hz

Shock resistance, half sinus, 11 ms

50 G (function)

1500 G (damage)

Degree of protection / Environmental protection

immersion cleanable, IP 67 / RT V

Needle flame test

application time 20 s, no burning

Mounting position

any

Processing information

Ultrasonic cleaning is not recommended

Weight (mass)

max. 2.5 g

Terminal surface

SnCu 0.7

Resistance to soldering heat

265 °C / 10 s

* Duration may be shorter depending on pulse shape, voltage applied and ambiente temperature

All data refers to 23 °C unless otherwise specified.