MKP 1848 DC-Link

Vishay Roederstein

Metallized Polypropylene Film Capacitors

DC Capacitor MKP Type

www.vishay.com

For technical questions, contact: dc-film@vishay.com

Document Number: 28164

290

Revision: 02-Feb-09

HEAT CONDUCTIVITY AND HOT SPOT TEMPERATURE

POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE

The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of

the free air ambient temperature.

The component temperature rise (

ΔT) can be measured or calculated by ΔT = P/G:

•

ΔT = Component temperature rise (°C)

• P = Power dissipation of the component (mW)

• G = Heat conductivity of the component (mW/°C)

MEASURING THE COMPONENT TEMPERATURE

The temperature rise is given by

ΔT = T

To avoid thermal radiation or convection, the capacitor must be tested in a closed area from air circulation.

(mm)

HEAT CONDUCTIVITY (mW/°C)

PITCH 27.5 mm

PITCH 37.5 mm

PITCH 52.5 mm

9.0

31

-

-

11.0

37

-

-

13.0

42

-

-

15.0

48

-

-

18.0

58

-

-

18.5

-

89

-

21.0

68

-

-

21.5

-

102

-

24.0

-

116

-

25.0

-

-

152

30.0

-

134

181

35.0

-

-

197

45.0

-

-

213

87.0

-

-

341

Thermocouple