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ZXMS6004DT8TA Datasheet(PDF) 3 Page - Diodes Incorporated |
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ZXMS6004DT8TA Datasheet(HTML) 3 Page - Diodes Incorporated |
3 / 9 page ZXMS6004DT8 Document Number DS32245 Rev. 1 - 2 3 of 9 www.diodes.com June 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL LIMIT UNIT Continuous Drain-Source Voltage VDS 60 V Drain-Source Voltage for short circuit protection VDS(SC) 36 V Continuous Input Voltage VIN -0.5 ... +6 V Continuous Input Current -0.2V ≤V IN≤6V VIN<-0.2V or VIN>6V IIN No limit │I IN │≤2 mA Operating Temperature Range Tj, -40 to +150 °C Storage Temperature Range Tstg -55 to +150 °C Power Dissipation at TA =25°C (a)(d) Linear Derating Factor PD 1.16 9.28 W mW/ °C Power Dissipation at TA =25°C (a)(e) Linear Derating Factor PD 1.67 13.3 W mW/ °C Power Dissipation at TA =25°C (b)(d) Linear Derating Factor PD 2.13 17 W mW/ °C Pulsed Drain Current @ VIN=3.3V (c) IDM 2 A Pulsed Drain Current @ VIN=5V (c) IDM 2.5 A Continuous Source Current (Body Diode) (a) IS 1 A Pulsed Source Current (Body Diode) (c) ISM 5 A Unclamped single pulse inductive energy, Tj=25 °C, ID=0.5A, VDD=24V EAS 210 mJ Electrostatic Discharge (Human Body Model) VESD 4000 V Charged Device Model VCDM 1000 V THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a)(d) RθJA 108 °C/W Junction to Ambient (a)(e) RθJA 75 °C/W Junction to Ambient (b)(d) RθJA 58.7 °C/W Junction to Case (f) RθJC 26.5 °C/W NOTES (a) For a dual device surface mounted on a 25mm x 25mm FR4 PCB single sided 1oz weight copper split down the middle on 1.6mm FR4 board, in still air conditions. (b) For a dual device surface mounted on FR4 PCB measured at t ≤ 10sec (c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.02 pulse width=300µs – pulse width limited by junction temperature. Refer to transient Thermal Impedance Graph. (d) For a dual device with one active die. (e) For dual device with 2 active die running at equal power. (f) Thermal resistance from junction to solder-point (at the end of the drain lead) |
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