ISO1050

www.ti.com

SLLS983C – JUNE 2009 – REVISED JULY 2010

IEC SAFETY LIMITING VALUES

safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of

the IO can allow low resistance to ground or the supply and, without current limiting dissipate sufficient power to overheat the

die and damage the isolation barrier potentially leading to secondary system failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

310

DUB-8

mA

474

Safety input, output, or supply current

299

DW-16

mA

457

Maximum case temperature

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assured junction-to-air thermal resistance in the

Thermal Characteristics table is that of a device installed on a High-K Test Board for Leaded Surface Mount

Packages. The power is the recommended maximum input voltage times the current. The junction temperature is

then the ambient temperature plus the power times the junction-to-air thermal resistance.

REGULATORY INFORMATION

VDE

CSA

UL

Certified according to IEC

Approved under CSA Component Acceptance

Recognized under 1577 Component Recognition

60747-5-2

Notice

File Number: 40016131

File Number: pending

File Number: pending

(1)

Production tested

≥ 3000 VRMS for 1 second in accordance with UL 1577.

THERMAL INFORMATION (DUB-8 PACKAGE)

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

120

°C/W

Junction-to-air

High-K Thermal Resistance

73.3

°C/W

Junction-to-board thermal

Low-K Thermal Resistance

10.2

°C/W

resistance

Junction-to-case thermal resistance Low-K Thermal Resistance

14.5

°C/W

Device power dissipation

TXD input is a 500kHz 50% duty-cycle square

200

mW

wave

190

°C

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

(2)

Extended operation in thermal shutdown may affect device reliability.

THERMAL INFORMATION (DW-16 PACKAGE)

ISO1050

DW

UNITS

16

Junction-to-ambient thermal resistance

76.0

Junction-to-case (top) thermal resistance

41

Junction-to-board thermal resistance

47.7

°C/W

Junction-to-top characterization parameter

14.4

Junction-to-board characterization parameter

38.2

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright © 2009–2010, Texas Instruments Incorporated

Submit Documentation Feedback

11

Product Folder Link(s): ISO1050