1

FEATURES

APPLICATIONS

YFC PACKAGE TERMINAL ASSIGNMENTS

YFC PACKAGE

B

C

D

1

2

3

Bump View

A

B

C

D

3

2

1

Laser Marking View

A

DESCRIPTION/ORDERING INFORMATION

TS5A22366

0.7-

Ω DUAL SPDT ANALOG SWITCH

WITH NEGATIVE RAIL CAPABILITY AND 1.8-V COMPATIBLE INPUT LOGIC

• Negative Signaling Capability: Maximum

• ESD Performance Tested Per JESD 22

–

2500-V Human-Body Model

• Low ON-State Resistance (0.7 Ω Typ)

(A114-B, Class II)

• Excellent ON-State Resistance Matching

–

1000-V Charged-Device Model (C101)

• 1.8-V Compatible Control Input Threshold

–

200-V Machine Model (A115-A)

• Control Inputs Are 5.5-V Tolerant

• Cell Phones

• 2.25-V to 5.5-V Power Supply (V

• PDAs

• Low Charge Injection

• Portable Instrumentation

• Specified Break-Before-Make Switching

• Audio Routing

• Latch-Up Performance Exceeds 100 mA Per

• Portable Media Players

JESD 78, Class II

D

NC1

NC2

C

COM1

GND

COM2

B

NO1

GND

NO2

A

IN1

IN2

1

2

3

(1)

N.C. –No internal connection

The TS5A22366 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V

to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the

switch without distortion.

The break-before-make feature prevents signal distortion during the transferring of a signal from one path to

another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total

harmonic distortion (THD) performance are ideal for audio applications.

The TS5A22366 is available is a ultra small 1.6 mm × 1.2 mm wafer-chip-scale package (WCSP) (0.4 mm pitch)

and in a 2 mm × 1.5 mm quad flat (QFN) package (0.5 mm pitch).

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

–40°C to 85°C

Tape and reel

TS5A22366YFCR

3A_

YFC (Pb-free)

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

YFC: The actual top-side marking has one additional character to designate the assembly/test site. Pin 1 identifier indicates solder-bump

composition (1 = SnPb, • = Pb-free).

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2009, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.