LVCMOS Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified. Applies to LT_EN, GPIO0, GPIO1,

GPIO2, RX_MUX_SEL, DC_B, RESET, RS, LOCK. (Note 2, Note 4, Note 5)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

V

IH

High Level Input Voltage

2.0

V

DD

V

V

IL

Low Level Input Voltage

GND

0.8

V

V

OH

High Level Output Voltage

I

2.7

3.2

V

V

OL

Low Level Output Voltage

I

0.3V

V

V

CL

Input Clamp Voltage

I

-0.9

−1.5

V

I

IN

Input Current

V

-40

40

μA

I

OS

Output Short Circuit Current

V

(Note 6)

-45

mA

SMBus Electrical Specifications

Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2, Note 5)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

V

SIL

Data, Clock Input Low Voltage

0.8

V

V

SIH

Data, Clock Input High Voltage

2.1

V

SDD

V

V

SDD

Nominal Bus Voltage

2.375

3.465

V

I

SLEAKB

Input Leakage Per Bus Segment

SCK and SDA pins

±200

µA

I

SLEAKP

Input Leakage Per Pin

±10

µA

C

SI

Capacitance for SDA and SCK

10

pF

SMBus Timing Specifications

Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2, Note 5)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

f

SMB

Bus Operating Frequency

10

100

kHz

t

BUF

Bus free time between top and start condition

4.7

μs

t

HD:STA

Hold time after (repeated) start condition. After this

period, the first clock is generated

4.0

µs

t

SU:STA

Repeated Start Condition Setup Time

(Note 3)

4.7

µs

t

HD:DAT

Data Hold Time

300

ns

t

SU:DAT

Data Setup Time

(Note 3)

250

ns

t

LOW

Clock Low Time

4.7

µs

t

HIGH

Clock High Time

4.0

50

µs

t

SU:CS

SMB_CS Setup Time

(Note 3)

30

ns

t

HS:CS

SMB_CS Hold Time

(Note 3)

100

ns

t

POR

Time in which the device must be operational after

power on

(Note 3)

500

ms

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