Technical Note

6/7

BD47

□□G series

www.rohm.com

2010.04 - Rev.C

© 2010 ROHM Co., Ltd. All rights reserved.

 Operation Notes

1.

Absolute maximum range

Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the

failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given

when a specific mode to be beyond absolute maximum ratings is considered.

2.

GND potential

GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if,

include transient feature.

3.

Electromagnetic Field

Mal-function may happen when the device is used in the strong electromagnetic field.

4.

Bypass Capacitor for Noise Rejection

Please put into the capacitor between VCC pin and GND, to reject noise. If extremely big capacitor is used, transient

response might be late. Please confirm sufficiently for the point.

5.

Short Circuit between Terminal and Soldering

Don’t short-circuit between Output pin and VCC pin, Output pin and GND pin, or VCC pin and GND pin. When soldering the

IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is

mistaken the IC may be destroyed.

6.

This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause

unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed

between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak

resistance.

7.

External parameters

The recommended parameter range for RL is 2k

Ω~1MΩ. There are many factors (board layout, etc) that can affect

characteristics. Please verify and confirm using practical applications.

8.

Power on reset operation

Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation.

9.

Precautions for board inspection

Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be

certain to use proper discharge procedure before each process of the test operation.

To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any

equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer

and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is

OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.

10.

When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic

unsettled, the couple capacitance, GND pattern of width and leading line must be considered.