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MCIMX31CJMN4D Datasheet(PDF) 1 Page - Freescale Semiconductor, Inc |
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MCIMX31CJMN4D Datasheet(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 108 page  © Freescale Semiconductor, Inc., 2005–2010. All rights reserved. Freescale Semiconductor Data Sheet: Technical Data This document contains information on a new product. Specifications and information herein are subject to change without notice. Document Number: MCIMX31C Rev. 4.3, 2/2010 MCIMX31C and MCIMX31LC Package Information Plastic Package Case 1931 19 x 19 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information. 1 Introduction The MCIMX31C and MCIMX31LC multimedia applications processors represent the next step in low-power, high-performance application processors. Unless otherwise specified, the material in this data sheet is applicable to both the MCIMX31C and MCIMX31LC processors and referred to singularly throughout this document as MCIMX31C. The MCIMX31LC does not include a graphics processing unit (GPU). Based on an ARM11™ microprocessor core, the MCIMX31C provides the performance with low power consumption required by modern digital devices such as: • Automotive infotainment and navigation • Industrial control (human interface) The MCIMX31C takes advantage of the ARM1136JF-S™ core running at 400 MHz, and is optimized for minimal power consumption using the most advanced techniques for power saving (DVFS, power gating, clock gating). With 90 nm technology and dual-Vt transistors (two threshold voltages), the MCIMX31C and MCIMX31LC Multimedia Applications Processors for Industrial and Automotive Products Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Ordering Information . . . . . . . . . . . . . . . . . . . . . .3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Functional Description and Application Information 4 ARM11 Microprocessor Core . . . . . . . . . . . . . . . .4 Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . .6 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . .9 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . .9 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . .9 Supply Power-Up/Power-Down Requirements and Restrictions . . . . . . . . . . . . . . . . . . . . . . . .15 Module-Level Electrical Specifications . . . . . . . .16 Package Information and Pinout . . . . . . . . . . . . . .99 MAPBGA Production Package 473 19 x 19 mm, 0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . .100 Product Documentation . . . . . . . . . . . . . . . . . . . .106 Revision History . . . . . . . . . . . . . . . . . . . . . . . .107 |
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