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HT66F03M Datasheet(PDF) 7 Page - Holtek Semiconductor Inc |
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HT66F03M Datasheet(HTML) 7 Page - Holtek Semiconductor Inc |
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7 / 13 page  HT68F03M/HT68F04M/HT66F03M/HT66F04M Rev. 1.10 7 May 24, 2010 Functional Description As these device packages contain multiple internal chips, for a detailed functional description, users must refer to the relevant individual datasheets for both the MCU and the DC-DC Converter. The following table shows which individual devices are inside each package. Device MCU DC-DC Converter HT68F03M HT68F03 HT7730 HT68F04M HT68F04 HT7730 HT66F03M HT66F03 HT7730 HT66F04M HT66F04 HT7730 Multi-chip Internal Devices Although most of the functional description material will be located in the individual datasheets, there are some special considerations which need to be taken into ac- count when using multi-chip devices. These points will be mentioned in the hardware and software consider- ation sections. Multi-chip Hardware Considerations As these single-package multi-chip devices are com- posed of an individual MCU and DC-DC converter chips, using them together requires the user to take care of some special points. · Absolute Maximum Ratings The Absolute Maximum Ratings for the two individual chips must be checked for discrepancies and the nec- essary care taken in device handling and usage. · Power Supply Examination of the block diagram will reveal that the DC-DC Converter Ground pin, GND, has no internal connection to the MCU Ground pin, VSS. For this rea- son these two pins must be connected externally. The DC-DC Converter output pin, VOUT is also not con- nected to the MCU power supply pin, VDD, so these two pins should also be connected together exter- nally. If the DC-DC Converter is used to power the MCU, then the MCU will always have a power supply of 3V, so care must be taken to only consult the MCU characteristics specified at this power supply voltage. If required, the MCU can be supplied directly on its VDD pin by an external power source if the DC-DC converter is not used. When calculating the total current consumption of the device, the internal DC specifications of the two inter- nal chips must be consulted and the individual cur- rents added together. As the MCU power supply may be supplied by the DC-DC Converter it is important to note that if the MCU is powered down or placed into a low power mode to conserve power, that the DC-DC Converter will continue running and will consume a certain amount of power. The DC-DC Converter can of course be powered down by pulling its CE pin low, however as its output voltage falls toward zero, the MCU will experience a reset. The CE pin must there- fore be held low for sufficient time to allow the VOUT voltage to fall to a level where the MCU will be prop- erly reset before being powered up again. Multi-chip Programming Considerations As there are no internal signal connections between the two internal chips there are no real programming con- siderations for these devices. It is only necessary to realise that if the MCU is switched into any of its low power modes or executes the HALT instruction by the application program to reduce power consumption, that the DC-DC Converter will continue operating and there- fore contribute to the overall power consumption. The DC-DC Converter can only be powered-down manually using its CE pin and if this is done the MCU will be reset. |
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