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M366S3323IUS Datasheet(PDF) 3 Page - Samsung semiconductor |
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M366S3323IUS Datasheet(HTML) 3 Page - Samsung semiconductor |
3 / 8 page General Information SDRAM November 2007 B. SDRAM Component Product Guide Density Bank Part Number Package*1 & Power*2 & Speed*3 Org. Interface Refresh Power (V) Package Avail. 64Mb K-die 4Banks K4S640832K UC75 UL75 8M x 8 LVTTL 4K/64ms 3.3 ± 0.3V Lead-free 54pin TSOP(II) EOL DEC. ’08 K4S641632K UC50/C60/C75 UL50/L60/L75 4M x 16 64Mb N-die 4Banks K4S640832N LC75 LL75 8M x 8 LVTTL 4K/64ms 3.3 ± 0.3V Lead-free & Halogen- free 54pin TSOP(II) 4Q’07 CS K4S641632N LC50/C60/C75 LL50/L60/L75 4M x 16 128Mb I-die 4Banks K4S280432I UC75 UL75 32M x 4 LVTTL 4K/64ms 3.3 ± 0.3V Lead-free 54pin TSOP(II) EOL AUG. ’08 K4S280832I UC75 UL75 16M x 8 K4S281632I UC60/C75 UL60/L75 8M x 16 128Mb K-die 4Banks K4S280432K U*4C75 UL75 32M x 4 LVTTL 4K/64ms 3.3 ± 0.3V Lead-free & Halogen- free 54pin TSOP(II)*4 Now K4S280832K UC75 UL75 16M x 8 K4S281632K UC60/C75 UL60/L75 8M x 16 256Mb H-die 4Banks K4S560432H UC75 UL75 64M x 4 LVTTL 8K/64ms 3.3 ± 0.3V Lead-free 54pin TSOP(II) EOL SEP. ’08 K4S560832H UC75 UL75 32M x 8 K4S561632H UC60/C75 UL60/L75 16M x 16 256Mb J-die 4Banks K4S560432J U*4C75 UL75 64M x 4 LVTTL 8K/64ms 3.3 ± 0.3V Lead-free & Halogen- free 54pin TSOP(II)*4 Now K4S560832J UC75 UL75 32M x 8 K4S561632J UC60/C75 UL60/L75 16M x 16 512Mb D-die 4Banks K4S510432D UC75 UL75 128M x 4 LVTTL 8K/64ms 3.3 ± 0.3V Lead-free 54pin TSOP(II) Now K4S510832D UC75 UL75 64M x 8 K4S511632D UC75 UL75 32M x 16 Note 2 : Temperature and Power Description C Temperature, Normal Power L Temperature, Low Power Note 1 : U : TSOP(II) (Lead-free) L : TSOP(II) (Lead-free & Halogen-free) Note 3 : * All products have backward compatibility with PC100. Speed Description 75 7.5ns, PC133 (133Mhz @ CL=3) 60 6.0 ns (166Mhz @ CL=3) 50 5.0 ns (200Mhz @ CL=3) - Commercial Temp (0 °C < Ta < 70°C) Note 4 : 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U) |
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