 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
K4S560432J Datasheet(PDF) 7 Page - Samsung semiconductor |
|
||||||||||||||||||||||||||||||
K4S560432J Datasheet(HTML) 7 Page - Samsung semiconductor |
|
|
7 / 15 page  - 7 - Product Guide Consumer Memory Apr. 2010 3. Industrial Temperature Consumer DRAM Component Product Guide 3.1 SDRAM NOTE : 1. 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U) 3.2 DDR SDRAM NOTE : 1. VDD/VDDQ SPEC for 256/512Mb DDR 3.3 DDR2 SDRAM 3.4 DDR3 SDRAM Density Bank Part Number Package & Power, Temp. & Speed Org. Interface Refresh Power (V) Package Avail. 64Mb N-die 4Banks KS641632N LI(P)60/I(P)75 4M x 16 LVTTL 4K/64ms 3.3 ±0.3V 54pin TSOP(II) Now 128Mb K-die 4Banks K4S281632K U*1I(P)60/I(P)75 8M x 16 LVTTL 4K/64ms 3.3 ±0.3V 54pin TSOP(II)*1 Now 128Mb O-die 4Banks K4S281632O LI(P)60/I(P)75 8M x 16 LVTTL 4K/64ms 3.3 ±0.3V 54pin TSOP(II) 3Q ’10 256Mb J-die 4Banks K4S561632J U*1I(P)60/I(P)75 16M x 16 LVTTL 8K/64ms 3.3 ±0.3V 54pin TSOP(II)*1 Now 256Mb N-die 4Banks K4S561632N LI(P)60/I(P)75 16M x 16 LVTTL 8K/64ms 3.3 ±0.3V 54pin TSOP(II) 2Q ’10 Density Bank Part Number Package & Power, Temp. & Speed Org. Interface Refresh Power (V) Package Avail. 512Mb F-die 4Banks K4H510838F LI(P)B3 64M x 8 SSTL_2 8K/64m 2.5±0.2V*1 66pinTSOPII Now K4H511638F LI(P)B3 32M x 16 66pinTSOPII HI(P)B3 60ball FBGA 512Mb G-die 4Banks K4H511638G LI(P)CC/B3 32M x 16 SSTL_2 8K/64m 2.5±0.2V*1 66pinTSOPII Now HI(P)CC/B3 60ball FBGA DDR400 DDR333/266 VDD/VDDQ 2.6V ± 0.1V 2.5V ± 0.2V Density Bank Part Number Package & Power, Temp. & Speed Org. Interface Refresh Power (V) Package Avail. 512Mb G-die 4Banks K4T51163QG HI(P)F7/I(P)E6/I(P)D5/ I(P)CC 32M x 16 SSTL_18 8K/64m 1.8V±0.1V 84ball FBGA Now K4T51163QG HDE6 512Mb I-die 4Banks K4T51163QI HI(P)E7/I(P)F7/I(P)E6 32M x 16 SSTL_18 8K/64m 1.8V±0.1V 84ball FBGA Now K4T51163QI HDE7/E6 1Gb E-die 8Banks K4T1G084QE HI(P)F7/I(P)E6 128M x 8 SSTL_18 8K/64m 1.8V ± 0.1V 60ball FBGA Now K4T1G164QE HI(P)F7/I(P)E6 64M x 16 84ball FBGA Now 1Gb F-die 8Banks K4T1G084QF BI(P)F7/I(P)E6 128M x 8 SSTL_18 8K/64m 1.8V ± 0.1V 60ball FBGA 2Q ’10 K4T1G164QF BI(P)F7/I(P)E6 64M x 16 84ball FBGA Density Bank Part Number Package & Power, Temp. & Speed Org. Interface Refresh Power (V) Package Avail. 1Gb E-die 8Banks K4B1G1646E HI(P)H9 64M x 16 SSTL_15 8K/64m 1.5V±0.075V 96ball FBGA Now 2Gb B-die 8Banks K4B2G1646B HI(P)H9 128M x 16 SSTL_15 8K/64m 1.5V±0.075V 96ball FBGA Now 2Gb C-die 8Banks K4B2G1646C HI(P)H9 128M x 16 SSTL_15 8K/64m 1.5V±0.075V 96ball FBGA 2Q ’10 |
Similar Part No. - K4S560432J |
|
Similar Description - K4S560432J |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
