K4H561638H datasheet(4/10 Pages) SAMSUNG

Part #	K4H561638H

Description	DDR SDRAM Product Guide

Download	10 Pages

Scroll/Zoom	100%

Manufacturer	SAMSUNG [Samsung semiconductor]

Direct Link	http://www.samsung.com/Products/Semiconductor

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4 / 10 page

DDR SDRAM

General Information

December 2007

Note 2 :

- Industrial Temp. (-40

°C <Ta< 85°C)

I

Industrial Temperature, Normal Power

P

Industrial Temperature, Low Power

Note 4 :

DDR400

DDR333/266

VDD/VDDQ

2.6V ± 0.1V

2.5V ± 0.2V

Note 3 :

- "B3" has compatibility with "A2" and "B0"

133Mhz

166Mhz

200Mhz

CL = 2

DDR266(A2)

-

CL = 2.5

DDR266(B0)

DDR333(B3)

-

CL = 3

-

DDR400(CC)

U

V

Z

: TSOP II (Lead-free)

: sTSOP II (Lead-free)

: FBGA (Lead-free)

L

H

F

6

: TSOP II (Lead-free & Halogen-free)

: FBGA (Lead-free & Halogen-free)

: FBGA for 64Mb DDR (Lead-free & Halogen-free)

: sTSOP II (Lead-free & Halogen-free)

Note 1 :

C. Industrial temp DDR SDRAM Component Product Guide

Density

Bank

Part Number

Package*1 & Power*2 & Speed*3

Org.

Interface

Refresh

Power (V)

Package

Avail.

256Mb H-die

4Banks K4H561638J

UICC/IB3/IB0

UPCC/PB3/PB0

16M x 16

SSTL_2

8K/64m

2.5 ± 0.2V*4

66pinTSOPII

Now

ZIB3/IB0

ZPB3/PB0

60ball FBGA

256Mb J-die

4Banks K4H561638J

LICC/IB3

LPCC/PB3

16M x 16

SSTL_2

8K/64m

2.5 ± 0.2V*4

66pinTSOPII

CS

512Mb D-die

4Banks

K4H510838D

UIB3/IB0

UPB3/PB0

64M x 8

SSTL_2

8K/64m

2.5 ± 0.2V*4

66pinTSOPII

Now

ZIB3/IB0

ZPB3/PB0

60ball FBGA

K4H511638D

UIB3/IB0

UPB3/PB0

32M x 16

66pinTSOPII

ZIB3/IB0

ZPB3/PB0

60ball FBGA

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