K4S280832K datasheet(11/15 Pages) SAMSUNG

Part #	K4S280832K

Description	Consumer Memory

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Manufacturer	SAMSUNG [Samsung semiconductor]

Direct Link	http://www.samsung.com/Products/Semiconductor

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Product Guide

Consumer Memory

Apr. 2010

TOP VIEW

BOTTOM VIEW

60Ball FBGA (for DDR2 1Gb F-die x8)

Units : Millimeters

(0.30)

# A1 INDEX MARK

(0.60)

7.50 ± 0.10

1.60

0.80 x 8 = 6. 40

0.80

A

B

A

B

C

D

E

F

H

J

K

L

G

3.20

98765

4321

60-

∅0.48 Solder ball

0.2 M AB

(Post reflow 0.50

± 0.05)

MOLDING AREA

(Datum A)

(Datum B)

7.50 ± 0.10

#A1

0.37±0.05

1.10±0.10

TOP VIEW

BOTTOM VIEW

84Ball FBGA (for DDR2 1Gb F-die x16)

Units : Millimeters

(0.30)

# A1 INDEX MARK

(0.60)

7.50 ± 0.10

1.60

0.80 x 8 = 6. 40

0.80

A

B

A

B

C

D

E

F

H

J

K

L

G

3.20

98765

4321

84-

∅0.48 Solder ball

0.2 M AB

(Post reflow 0.50

± 0.05)

MOLDING AREA

(Datum A)

(Datum B)

M

N

P

R

7.50 ± 0.10

#A1

0.37±0.05

1.10±0.10

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K4S280832K Datasheet(PDF) 11 Page - Samsung semiconductor

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