5

GX Series

Unreeling direction

12

4

2

Unreeling direction

2

26

●Reel Dimensions

BRecommended reflow temperature profile - receptacles

160

190

220

250

230ç min.

150

∼180ç

60s

30s

Time(Seconds)

240ç

230ç min.

●HRS test condition

KSolder composition

:Paste,96.5%Sn/3.0%Ag/0.5%Cu

KTest board

:Glass epoxy35mm∞50mm∞0.8mm thick

The temperature profiles are based on the above

conditions.

In individual applications the actual temperature

may vary, depending on solder paste type,

volume / thickness and board size / thickness.

Consult your solder paste and equipment

manufacturer for specific recommendations.

● Using lead-free solder paste.

■Packaging Specifications

●Embossed carrier tape dimensions

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.