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LNK456D Datasheet(PDF) 10 Page - Power Integrations, Inc. |
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LNK456D Datasheet(HTML) 10 Page - Power Integrations, Inc. |
10 / 12 page Rev. A 06/10 10 LNK454/456-458/460 www.powerint.com This document contains information on a new product. Specifications and information herein are subject to change without notice. PRELIMINARY PI-4526-040110 D07C 3.90 (0.154) BSC Notes: 1. JEDEC reference: MS-012. 2. Package outline exclusive of mold flash and metal burr. 3. Package outline inclusive of plating thickness. 4. Datums A and B to be determined at datum plane H. 5. Controlling dimensions are in millimeters. Inch dimensions are shown in parenthesis. Angles in degrees. 0.20 (0.008) C 2X 1 4 5 8 2 6.00 (0.236) BSC D 4 A 4.90 (0.193) BSC 2 0.10 (0.004) C 2X D 0.10 (0.004) C 2X A-B 1.27 (0.050) BSC 7X 0.31 - 0.51 (0.012 - 0.020) 0.25 (0.010) M C A-B D 0.25 (0.010) 0.10 (0.004) (0.049 - 0.065) 1.25 - 1.65 1.75 (0.069) 1.35 (0.053) 0.10 (0.004) C 7X C H 1.27 (0.050) 0.40 (0.016) GAUGE PLANE 0 - 8 1.04 (0.041) REF 0.25 (0.010) BSC SEATING PLANE 0.25 (0.010) 0.17 (0.007) DETAIL A DETAIL A C SEATING PLANE Pin 1 ID B 4 4.90 (0.193) 1.27 (0.050) 0.60 (0.024) 2.00 (0.079) Reference Solder Pad Dimensions SO-8C (D Package) |
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