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PMK35EP Datasheet(PDF) 2 Page - NXP Semiconductors

Part # PMK35EP
Description  P-channel TrenchMOS extremely low level FET
Download  12 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PMK35EP Datasheet(HTML) 2 Page - NXP Semiconductors

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PMK35EP
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 29 April 2010
2 of 12
NXP Semiconductors
PMK35EP
P-channel TrenchMOS extremely low level FET
2.
Pinning information
3.
Ordering information
4.
Limiting values
Table 2.
Pinning information
Pin
Symbol
Description
Simplified outline
Graphic symbol
1S
source
SOT96-1 (SO8)
2S
source
3S
source
4
G
gate
5
D
drain
6
D
drain
7
D
drain
8
D
drain
4
5
1
8
G
D
S
001aaa025
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PMK35EP
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
25 °C
≤ Tj ≤ 150 °C
---30
V
VDGR
drain-gate voltage
25 °C
≤ Tj ≤ 150 °C; RGS =20 kΩ
---30
V
VGS
gate-source voltage
-25
-
25
V
ID
drain current
Tsp =25 °C; VGS = -10 V; see Figure 1;
see Figure 3
---14.9
A
Tsp = 100 °C; VGS = -10 V; see Figure 1
---7
A
IDM
peak drain current
Tsp =25 °C; tp ≤ 10 µs; pulsed;
see Figure 3
---28.8
A
Ptot
total power dissipation
Tsp =25 °C; see Figure 2
--6.9
W
Tstg
storage temperature
-55
-
150
°C
Tj
junction temperature
-55
-
150
°C
Source-drain diode
IS
source current
Tsp = 25 °C
---5.8
A
ISM
peak source current
Tsp =25 °C; tp ≤ 10 µs; pulsed
-
-
-23
A


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