33

4

RoHS Compliant

Solder Reflow and Rework Recommendation for PolyZen Devices

Critical Zone

T

Ramp up

t 25˚C to Peak

Reflow Profile

Time

Ramp down

ts

Preheat

Ts

MAX

T

L

Tp

tp

25

Ts

MIN

t

L

Figure PZ23

Classification Reflow Profiles

Profile Feature

Pb-Free Assembly

3°C/second max.

Preheat

150°C

200°C

60-180 seconds

Time maintained above:

217°C

60-150 seconds

Peak/Classification temperature (Tp)

260°C

Time within 5°C of actual peak temperature

Time (tp)

20-40 seconds

Ramp down rate

6°C/second max.

Time 25°C to peak temperature

8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Description

ZENxxxVyyyAzzLS/M Devices

ZENxxxVyyyAzzGS Devices

4.35

4.35

4.35

4.35

2.30

1.80

A

0

B

0

K

0

2.00 ± 0.05

Note 3

0.35 ± 0.05

4.00

Note 1

8.00

ø1.5 + 0.1 / -0.0

ø1.50 Min

0.25 R

0.25

12.0 ± 0.3

5.50 ± 0.05

Note 3

1.75 ± 0.10

A

A

R 0.3 Max

Notes:

1. 10 sprocket hole pitch cumulative tolerance ±0.2

2. Camber in compliance with EIA 481

3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole

Tape and Reel Specifications for PolyZen Devices (in Millimeters)

Figure PZ24 EIA Referenced Taped Component Dimensions for PolyZen Devices (in Millimeters)