PMEG2010ER_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 29 December 2008

10 of 13

NXP Semiconductors

PMEG2010ER

10. Packing information

[1]

For further information and the availability of packing methods, see Section 14.

11. Soldering

Table 8.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000

PMEG2010ER

SOD123W

4 mm pitch, 8 mm tape and reel

-115

Reflow soldering is the only recommended soldering method.

Fig 15. Reflow soldering footprint SOD123W

2.9

2.8

4.4

1.6

2.1

1.2

(2

×)

1.1

(2

×)

solder lands

solder resist

occupied area

solder paste

1.1

(2

×)

1.2

(2

×)

sod123w_fr

Dimensions in mm