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MP3V5004G Datasheet(PDF) 4 Page - Freescale Semiconductor, Inc |
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MP3V5004G Datasheet(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 14 page MP3V5004G Sensors 4 Freescale Semiconductor Pressure On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482A). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MP3V5004G series sensor operating characteristics are based on the use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MP3V5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10 °C to 60°C using the decoupling circuit shown in Figure 3 The output will saturate outside of the specified pressure range. Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering. (For additional output filtering, please refer to Application Note AN1646.) Figure 4. Output vs. Pressure Differential at ±2.5% VFSS (See Note 5 in Operating Characteristics table) +3 V 1.0 μF 0.01 μF 470 pF GND Vs Vout IPS OUTPUT Fluorosilicone Gel Die Coat Differential Sensing Element Stainless Steel Cap P1 P2 Die Bond Die Thermoplas- tic Lead Frame Wire Bond 3.0 1.0 2.0 0.6 Max Min Typical 2 kPa 200 mm H2O 4 kPa 400 mm H2O TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS VS = 3.0 V ± 0.30 Vdc TEMP = 10 to 60°C |
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