Datasheet for 76650-0232

General Information

Kit Part Number:

76650-0232

Connector Type:

Board-to-Board, Wire-to-Board

Solution:

High Speed

Molex Family:

Plateau HS Mezz™, SEARAY*, SEARAY* Slim

Certificates:

N/A

Country of Origin:

Kit assembled in U.S.A

Specifications

Circuit Size:

18, 200, 300, 400, 48

Current Rating:

1.5A, 2.7A

Mounting Style:

PCB Through Hole, SMT (Surface Mount Technology)

Orientation:

Plugs, Vertical Receptacles

Pitch:

1.20mm (.047"), 1.27mm (.050") by 1.27mm (.050")

Speed:

10 Gbps (Gigabits Per Second)

Stack Height:

Assorted Stack Heights from 4.5mm-17mm

Style:

Mezzanine

Voltage Rating:

240V, 30V

Product Hightlights

SEARAY* Slim is a solution armed with the benefits of the standard SEARAY* family but with a width similar to 2 row mezzanine products. The

design gives a system a highly compact solution but with speed capabilities of 12.5 Gbps, a level of performance most other 2 row products

cannot achieve today. As system level speeds approach 5Gbps and beyond, SEARAY* is an enticing mezzanine architecture that provides

headroom for future generation iterations as protocol speeds continue to increase. Plateau HS Mezz™ utilizes proprietary Plateau Technology™

(plated gold housing) to provide a high-speed high-density mezzanine connector system for differential and single-ended signal applications. The

gold-plated plastic shields each differential pair from neighboring pairs, lowering crosstalk and improving signal clarity. Different stack heights and

circuit sizes provide flexibility in design and grounding the conductive housing eliminates the need for individual ground pin designations within the

connector. The SEARAY* board-to-board connector is designed for computer, networking, telecom, storage and general market applications with

high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards (PCBs). The design of our SEARAY* has

superior electrical and mechanical features that are cost competitive. The unique, Molex patented, solder charge technology results in better

process yields a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated

stack heights cover 7mm (.276") to 13mm (.512").

Features and Benefits

• Advanced gold-plated housings with integrated shielding system

• Two points of contact on each signal

• Multiple stack heights

• Data rates up to 12.5Gbps provide excellent signal clarity and large bandwidth

• Narrow body width comparable to 2 row SMT has a minimal PCB footprint for high density board designs

• Robust contact design prevents stubbing and damage in mating interface

• Unique patented solder attach is more cost effective and reliable than BGA

• SEARAY* footprint is compatible with other 1.27mm(.050") by 1.27mm(.050") products

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