PESD5V0U5BF_PESD5V0U5BV_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 15 August 2008

9 of 12

NXP Semiconductors

PESD5V0U5BF; PESD5V0U5BV

Ultra low capacitance bidirectional fivefold ESD protection arrays

11. Soldering

Reflow soldering is the only recommended soldering method.

Fig 8.

Reflow soldering footprint PESD5V0U5BF (SOT886)

Reflow soldering is the only recommended soldering method.

Fig 9.

Reflow soldering footprint PESD5V0U5BV (SOT666)

sot886_fr

solder lands

occupied area

solder paste

Dimensions in mm

0.425

(6

×)

1.250

0.675

1.700

0.325

(6

×)

0.270

(6

×)

0.370

(6

×)

0.500

0.500

solder lands

placement area

occupied area

solder paste

sot666_fr

2.75

2.45

2.1

1.6

0.4

(6

×)

0.55

(2

×)

0.25

(2

×)

0.6

(2

×)

0.65

(2

×)

0.3

(2

×)

0.325

(4

×)

0.45

(4

×)

0.5

(4

×)

0.375

(4

×)

1.7

2

1.7

1.075

0.538

Dimensions in mm