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PESD5V0U5BF Datasheet(PDF) 9 Page - NXP Semiconductors |
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PESD5V0U5BF Datasheet(HTML) 9 Page - NXP Semiconductors |
9 / 12 page PESD5V0U5BF_PESD5V0U5BV_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 15 August 2008 9 of 12 NXP Semiconductors PESD5V0U5BF; PESD5V0U5BV Ultra low capacitance bidirectional fivefold ESD protection arrays 11. Soldering Reflow soldering is the only recommended soldering method. Fig 8. Reflow soldering footprint PESD5V0U5BF (SOT886) Reflow soldering is the only recommended soldering method. Fig 9. Reflow soldering footprint PESD5V0U5BV (SOT666) sot886_fr solder lands occupied area solder paste Dimensions in mm 0.425 (6 ×) 1.250 0.675 1.700 0.325 (6 ×) 0.270 (6 ×) 0.370 (6 ×) 0.500 0.500 solder lands placement area occupied area solder paste sot666_fr 2.75 2.45 2.1 1.6 0.4 (6 ×) 0.55 (2 ×) 0.25 (2 ×) 0.6 (2 ×) 0.65 (2 ×) 0.3 (2 ×) 0.325 (4 ×) 0.45 (4 ×) 0.5 (4 ×) 0.375 (4 ×) 1.7 2 1.7 1.075 0.538 Dimensions in mm |
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