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76650-0119 Datasheet(PDF) 1 Page - MolexKits

Part # 76650-0119
Description  High Density Mezz Interconnect Plug and Receptacle
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Manufacturer  MOLEXKITS [MolexKits]
Direct Link  http://www.molexkits.com
Logo MOLEXKITS - MolexKits

76650-0119 Datasheet(HTML) 1 Page - MolexKits

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1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0119
SEARAY Slim Connector Kit
Design
Configuration:
Specifications
76650-0119
Manufacturer:
Country of Origin:
SEARAY Slim
Certificates:
High Density Mezz Interconnect Plug and Receptacle
RoHS Compliant, China RoHS, UL, CSA
Title:
Applications
General Information
Molex / Waldom
Board-to-Board
1.27mm (.050") by 1.27mm (.050") Pitch
Kit assembled in U.S.A.
Description:
Product Family:
Part Number:
240 Volts
Circuit Sizes:
80 and 160
Pitch:
Mounting
Orientation:
Connector Type:
Receptacle and Plug
Vertical
Product Highlights
SEARAY Slim is a solution armed with the benefits of the standard SEARAY family
but with a width similar to 2 row mezzanine products. The design gives a system a
highly compact solution but with speed capabilities of 12.5 Gbps, a level of
performance most other 2 row products cannot achieve today. As system level
speeds approach 5Gbps and beyond, SEARAY is an enticing mezzanine
architecture that provides headroom for future generation iterations as protocol
speeds continue to increase.
Features and Benefits
• Mezzanine add-on cards
• Memory expansion
• I/O expansion
• Controller cards
• Motherboard personality cards
• Narrow body width comparable to 2 row
SMT has a minimal PCB footprint for high
density board designs
• Data rates up to 12.5Gbps provide
excellent signal clarity and large bandwidth
• Robust contact design prevents stubbing
and damage in mating interface
Current Rating:
2.7 Amps
Voltage:
*SEARAY is a trademark of Samtec, Inc.
For additional Molex / Waldom Design and Solution kits please go to www.molexkits.com
Page 1 of 2


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