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MC9RS08KB12CTG Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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MC9RS08KB12CTG Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
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7 / 48 page  Electrical Characteristics MC9RS08KB12 Series MCU Data Sheet, Rev. 3 Freescale Semiconductor 7 3.4 Thermal Characteristics This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the MCU design. In order to take PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small. The average chip-junction temperature (TJ) in °C can be obtained from: TJ = TA + (PD × θJA) Eqn. 1 where: TA = Ambient temperature, °C θJA = Package thermal resistance, junction-to-ambient, °C /W PD = Pint + PI/O Pint = IDD × VDD, Watts chip internal power PI/O = Power dissipation on input and output pins user determined Storage temperature range Tstg –55 to 150 °C 1 Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp voltages, then use the larger of the two resistance values. 2 All functional non-supply pins are internally clamped to V SS and VDD except the RESET/VPP pin which is internally clamped to VSS only. 3 Power supply must maintain regulation within operating V DD range during instantaneous and operating maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if the clock rate is very low which would reduce overall power consumption. Table 4. Thermal Characteristics Rating Symbol Value Unit Operating temperature range (packaged) TA TL to TH –40 to 85 °C Maximum junction temperature TJMAX 150 °C Thermal resistance 20-pin SOIC θ JA 83 °C/W Thermal resistance 16-pin SOIC NB θ JA 103 °C/W Thermal resistance 16-pin TSSOP θ JA 29 °C/W Thermal resistance 8-pin SOIC θ JA 150 °C/W Thermal resistance 8-pin DFN θ JA 110 °C/W Table 3. Absolute Maximum Ratings (continued) Rating Symbol Value Unit |
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