PBLS6023D_1

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 01 — 13 August 2009

4 of 16

NXP Semiconductors

PBLS6023D

60 V, 1.5 A PNP BISS loadswitch

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

[3]

(3) FR4 PCB, standard footprint

Fig 1.

Per device: Power derating curves

−75

175

125

25

75

−25

006aab507

400

600

200

800

1000

(mW)

0

(1)

(2)

(3)

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device

thermal resistance from

junction to ambient

in free air

[1] -

-

260

K/W

[2] -

-

211

K/W

[3] -

-

165

K/W

thermal resistance from

junction to solder point

-

-

100

K/W