GTL2018_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 15 February 2007

9 of 14

NXP Semiconductors

GTL2018

8-bit LVTTL to GTL transceiver

13. Package outline

Fig 7.

Package outline SOT355-1 (TSSOP24)

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

7.9

7.7

4.5

4.3

0.65

6.6

6.2

0.4

0.3

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT355-1

MO-153

99-12-27

03-02-19

0.25

0.5

0.2

Z

e

112

24

13

pin 1 index

θ

A

Q

detail X

L

(A )

3

E

c

X

A

D

y

0

2.5

5 mm

scale

TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm

SOT355-1

A

max.

1.1