BUK9620-100B_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 6 May 2009

4 of 12

NXP Semiconductors

BUK9620-100B

N-channel TrenchMOS logic level FET

5.

Thermal characteristics

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to mounting

base

see Figure 4

-

-

0.75

K/W

thermal resistance from

junction to ambient

mounted on printed circuit board;

minimum footprint; SOT404 package

-50

-

K/W

Fig 4.

Transient thermal impedance from junction to mounting base as a function of pulse duration

003a a c770

10

-3

10

-2

10

-1

1

1e -6

10

-5

10

-4

10

-3

10

-2

10

-1

1

(K/W)

δ = 0.5

0.2

0.1

0.05

single shot

0.02

T

P

t

T

δ =