IT3 Thermal Cycling Test

TR0636E-10026

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The following parameters were applied to simulate various manufacturing and connector usage

situations.

4.1 Connector Type

Mezzanine Connector: Hirose IT3 series

Receptacle

IT3M-300S-BGA(57)

…Mounted on Mother Board

IT3D-300S-BGA(57)

…Mounted on Daughter Card

Interposer assembly

IT3-300P-17H(03)

…17 mm Stacking Height

IT3-300P-32H(03)

…32 mm Stacking Height

IT3 Connector

4.2 Test Vehicle Configuration

Boards were designed to a thickness of 3.3 mm (125 mils) per IPC-9701

4.2.1 Multiple Connector Mount

In many applications, multiple connectors are mounted on one daughter card which can create

potential alignment issues and different stresses on solder joints. This test covers multiple

connector mounting in various configurations.

Config. 1

Config. 2

Config. 3

Config. 4

Numbers of connectors

/ Daughter card

1

2

2

4

Remarks

Individual

X Direction(2 CN)

Y Direction(2CN)

Quad(4 CN)

Receptacle

Interposer

Assembly