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ACASN1100K2200P5AT Datasheet(PDF) 5 Page - Vishay Siliconix |
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ACASN1100K2200P5AT Datasheet(HTML) 5 Page - Vishay Siliconix |
5 / 8 page www.vishay.com For technical questions, contact: thinfilmarray@vishay.com Document Number: 28770 280 Revision: 06-Nov-09 ACAS 0606 AT, ACAS 0612 AT - Precision Vishay Beyschlag Precision Thin Film Chip Resistor Array Superior Moisture Resistivity DESCRIPTION The production of the components is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade (96 % Al2O3) ceramic substrate using a mask to separate the adjacent resistors and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are realized on both sides. A special laser is used to achieve the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. Only accepted products are laid directly into the paper tape in accordance with IEC 60286-3 (3). ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using reflow or vapour phase as shown in IEC 61760-1 (3). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS compliant; the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The permitted storage time is 20 years, whereas the solderability is specified for 2 years after production or requalification. The immunity of the plating against tin whisker growth has been proven under extensive testing. All products comply with the GADSL (1) and the CEFIC-EECA-EICTA (2) list of legal restrictions on hazardous substances. This includes full compliance with the following directives: • 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) • 2002/95/EC Restriction of the use of Hazardous Substances directive (RoHS) • 2002/96/EC Waste Electrical and Electronic Equipment Directive (WEEE) APPROVALS The chip resistor array is AEC-Q200 qualified. Where applicable, the resistors are tested in accordance with EN 140401-801 which refers to EN 60115-1 and EN 140400. Notes (1) Global Automotive Declarable Substance List, see www.gadsl.org (2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade organisation representing the information and communications technology and consumer electronics), see www.eicta.org → policy → environmental policy group → chemicals → jig → Joint Industry Guide (JIG-101 Ed 2.0) (3) The quoted IEC standards are also released as EN standards with the same number and identical contents FUNCTIONAL PERFORMANCE 100 - 55 Ambient Temperature in °C 155 0 050 70 Derating Power Mode Standard Mode 20 40 60 80 100 125 180 For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER, above |
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