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TXB0101DCKRG4 Datasheet(PDF) 1 Page - Texas Instruments |
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TXB0101DCKRG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 22 page 1 FEATURES See mechanical drawings for dimensions. DBV PACKAGE (TOP VIEW) 2 GND OE 5 3 4 A B 6 1 V CCA V CCB DCK PACKAGE (TOP VIEW) 3 4 A 2 GND B 5 1 V CCA OE 6 V CCB DRL PACKAGE (TOP VIEW) 2 GND OE 5 1 V CCA 3 4 A B 6 V CCB YZP PACKAGE (BOTTOM VIEW) 2 GND OE 1 5 V CCA A 4 3 B 6 V CCB B1 A1 C1 B2 A2 C2 DESCRIPTION/ORDERING INFORMATION TXB0101 www.ti.com........................................................................................................................................... SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION 2 • Available in the Texas Instruments NanoFree™ • Latch-Up Performance Exceeds 100 mA Per Package JESD 78, Class II • 1.2 V to 3.6 V on A Port and • ESD Protection Exceeds JESD 22 1.65 V to 5.5 V on B Port (VCCA ≤ VCCB) – A Port • V CC Isolation Feature – If Either VCC Input Is at – 2000-V Human-Body Model (A114-B) GND, All Outputs Are in the High-Impedance – 250-V Machine Model (A115-A) State – 1500-V Charged-Device Model (C101) • OE Input Circuit Referenced to V CCA – B Port • Low Power Consumption, 5-µA Max I CC – 15-kV Human-Body Model (A114-B) • I off Supports Partial-Power-Down Mode – 250-V Machine Model (A115-A) Operation – 1500-V Charged-Device Model (C101) This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2007–2008, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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