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TPS73525DRBRG4 Datasheet(PDF) 10 Page - Texas Instruments |
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TPS73525DRBRG4 Datasheet(HTML) 10 Page - Texas Instruments |
10 / 26 page V =xV N OUT 11 V mVRMS TPS735xx SBVS087H – JUNE 2008 – REVISED NOVEMBER 2009 www.ti.com optimize noise, equivalent series resistance of the As with any linear regulator, PSRR and transient output capacitor can be set to approximately 0.2 Ω. response are degraded as (VIN – VOUT) approaches This configuration maximizes phase margin in the dropout. This effect is shown in the Typical control loop, reducing total output noise by up to Characteristics section. 10%. Startup and Noise Reduction Capacitor Noise can be referred to the feedback point (FB pin) such that with CNR = 0.01μF, total noise is given Fixed voltage versions of the TPS735xx use a approximately by Equation 1: quick-start circuit to fast-charge the noise reduction capacitor, CNR, if present (see the Functional Block Diagrams). This architecture allows the combination (1) of very low output noise and fast start-up times. The The TPS73501 adjustable version does not have the NR pin is high impedance so a low leakage CNR noise-reduction pin available, so ultra-low noise capacitor must be used; most ceramic capacitors are operation is not possible. Noise can be minimized appropriate in this configuration. according to the above recommendations. Note that for fastest startup, VIN should be applied first, then the enable pin (EN) driven high. If EN is Board Layout Recommendations to Improve tied to IN, startup is somewhat slower. Refer to the PSRR and Noise Performance Typical Characteristics section. The quick-start switch To improve ac performance such as PSRR, output is closed for approximately 135 μs. To ensure that noise, and transient response, it is recommended that CNR is fully charged during the quick-start time, a the board be designed with separate ground planes 0.01 μF or smaller capacitor should be used. for VIN and VOUT, with each ground plane connected only at the GND pin of the device. In addition, the Transient Response ground connection for the bypass capacitor should As with any regulator, increasing the size of the connect directly to the GND pin of the device. output capacitor reduces over/undershoot magnitude but increases duration of the transient response. In Internal Current Limit the adjustable version, adding CFB between OUT and The TPS735xx internal current limit helps protect the FB improves stability and transient response. The regulator during fault conditions. During current limit, transient response of the TPS735xx is enhanced by the output sources a fixed amount of current that is an active pull-down that engages when the output largely independent of output voltage. For reliable overshoots by approximately 5% or more when the operation, the device should not be operated in device is enabled. When enabled, the pull-down current limit for extended periods of time. device behaves like a 400 Ω resistor to ground. The PMOS pass element in the TPS735xx has a Undervoltage Lock-Out (UVLO) built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This The TPS735xx utilizes an undervoltage lock-out current is not limited, so if extended reverse voltage circuit to keep the output shut off until internal operation is anticipated, external limiting may be circuitry is operating properly. The UVLO circuit has a appropriate. de-glitch feature so that it typically ignores undershoot transients on the input if they are less Shutdown than 50 μs duration. The enable pin (EN) is active high and is compatible Minimum Load with standard and low voltage TTL-CMOS levels. When shutdown capability is not required, EN can be The TPS735xx is stable and well-behaved with no connected to IN. output load. To meet the specified accuracy, a minimum load of 500 μA is required. Below 500μA at Dropout Voltage junction temperatures near +125°C, the output can drift up enough to cause the output pull-down to turn The TPS735xx uses a PMOS pass transistor to on. The output pull-down limits voltage drift to 5% achieve low dropout. When (VIN – VOUT) is less than typically but ground current could increase by the dropout voltage (VDO), the PMOS pass device is approximately 50 μA. In typical applications, the in its linear region of operation and the input-to-output junction cannot reach high temperatures at light loads resistance is the RDS, ON of the PMOS pass element. because there is no appreciable dissipated power. Because the PMOS device behaves like a resistor in The specified ground current would then be valid at dropout, VDO approximately scales with output no load in most applications. current. 10 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated |
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