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BLA1011-200R Datasheet(PDF) 6 Page - NXP Semiconductors |
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BLA1011-200R Datasheet(HTML) 6 Page - NXP Semiconductors |
6 / 13 page BLA1011-200R_1011S-200R_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 23 February 2010 6 of 13 NXP Semiconductors BLA1011-200R; BLA1011S-200R Avionics LDMOS transistors 8. Test information Dimensions in mm. The components are situated on one side of the copper-clad Duroid Printed-Circuit Board (PCB) with εr = 6.2 and thickness 0.64 mm. The other side is unetched and serves as a ground plane. See Table 8 for list of components. Fig 8. Component layout for 1030 MHz to 1090 MHz test circuit 40 40 60 C2 C11 L1 R1 C1 C7 C9 C10 C8 C6 R2 C3 C4 C5 + mgw032 |
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