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74LVC1G58GM Datasheet(PDF) 7 Page - NXP Semiconductors |
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74LVC1G58GM Datasheet(HTML) 7 Page - NXP Semiconductors |
7 / 18 page 74LVC1G58_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 27 April 2009 7 of 18 NXP Semiconductors 74LVC1G58 Low-power configurable multiple function gate [1] Typical values are measured at maximum VCC and Tamb =25 °C. 11. Dynamic characteristics [1] Typical values are measured at nominal VCC and at Tamb =25 °C. [2] tpd is the same as tPLH and tPHL [3] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(C L × VCC 2 × f o) = sum of outputs. IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V - - ±200 µA ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO =0A - - 200 µA ∆ICC additional supply current VI =VCC − 0.6 V; IO =0A; VCC = 2.3 V to 5.5 V - - 5000 µA Table 8. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 13. Symbol Parameter Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ[1] Max Min Max tpd propagation delay A, B, C to Y; see Figure 12 [2] VCC = 1.65 V to 1.95 V 1.0 6.0 14.4 1.0 18.0 ns VCC = 2.3 V to 2.7 V 0.5 3.5 8.3 0.5 10.4 ns VCC = 2.7 V 0.5 4.2 8.5 0.5 10.6 ns VCC = 3.0 V to 3.6 V 0.5 3.8 6.3 0.5 7.9 ns VCC = 4.5 V to 5.5 V 0.5 3.0 5.1 0.5 6.4 ns CPD power dissipation capacitance VCC = 3.3 V; VI = GND to VCC [3] -20- - - pF |
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