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TPS7A4501DCQR Datasheet(PDF) 2 Page - Texas Instruments |
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TPS7A4501DCQR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 25 page TPS7A45xx SLVS720C – JUNE 2008 – REVISED SEPTEMBER 2009 ................................................................................................................................................ www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) (2) PRODUCT VOUT xx is nominal output voltage 15 = 1.5 V, 18 = 1.8 V, 25 = 2.5 V, 33 = 3.3 V, 01 = adjustable TPS7A45xxyyyz yyy is package designator (DCQ or KTT) z is package quantity (R = 2500 for DCQ, 500 for KTT) (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. ABSOLUTE MAXIMUM RATINGS (1) over operating virtual-junction temperature range (unless otherwise noted) IN –20 V to 20 V OUT –20 V to 20 V Input-to-output differential(2) –20 V to 20 V Input voltage range, VIN SENSE –20 V to 20 V ADJ –7 V to 7 V SHDN –20 V to 20 V Output short-circuit duration, tshort Indefinite Maximum lead temperature (10-s soldering time), Tlead 300°C Operating virtual junction temperature range, TJ –40°C to 125°C Storage temperature range, Tstg –65°C to 150°C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Absolute maximum input-to-output differential voltage cannot be achieved with all combinations of rated IN pin and OUT pin voltages. With the IN pin at 20 V, the OUT pin may not be pulled below 0 V. The total measured voltage from IN to OUT can not exceed ±20 V. PACKAGE THERMAL DATA (1) PACKAGE BOARD θJA θJC θJP (2) TO-223 (DCQ) Low K, JESD 51-5 53°C/W 15°C/W N/A TO-263 (KTT) High K, JESD 51-5 26.5°C/W 24.1°C/W 0.38°C/W (1) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. (2) For packages with exposed thermal pads, such as QFN, PowerPAD™, and PowerFLEX™, θJP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. 2 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS7A45xx |
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