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OPA4141AIDR Datasheet(PDF) 3 Page - Texas Instruments |
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OPA4141AIDR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 23 page OPA141 OPA2141 OPA4141 www.ti.com SBOS510B – MARCH 2010 – REVISED MAY 2010 THERMAL INFORMATION OPA141, OPA141, OPA2141 OPA2141 THERMAL METRIC UNITS D (SO) DGK (MSOP)(1) 8 8 qJA Junction-to-ambient thermal resistance(2) 160 180 qJC(top) Junction-to-case(top) thermal resistance(3) 75 55 qJB Junction-to-board thermal resistance(4) 60 130 °C/W yJT Junction-to-top characterization parameter(5) 9 n/a yJB Junction-to-board characterization parameter(6) 50 120 qJC(bottom) Junction-to-case(bottom) thermal resistance(7) n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. THERMAL INFORMATION OPA4141 OPA4141 THERMAL METRIC D (SO) PW (TSSOP)(1) UNITS 14 14 qJA Junction-to-ambient thermal resistance(2) 97 135 qJC(top) Junction-to-case(top) thermal resistance(3) 56 45 qJB Junction-to-board thermal resistance(4) 53 66 °C/W yJT Junction-to-top characterization parameter(5) 19 n/a yJB Junction-to-board characterization parameter(6) 46 60 qJC(bottom) Junction-to-case(bottom) thermal resistance(7) n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Copyright © 2010, Texas Instruments Incorporated 3 Product Folder Link(s): OPA141 OPA2141 OPA4141 |
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