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PAM1806BZCED3 Datasheet(PDF) 6 Page - Texas Instruments |
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PAM1806BZCED3 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 241 page  AM1806 SPRS658B – FEBRUARY 2010 – REVISED MAY 2010 www.ti.com 1 AM1806 ARM Microprocessor ........................ 1 6.7 Interrupts ............................................ 75 6.8 Power and Sleep Controller (PSC) ................. 81 1.1 Features .............................................. 1 6.9 EDMA ............................................... 86 1.2 Trademarks .......................................... 3 6.10 External Memory Interface A (EMIFA) ............. 92 1.3 Description ........................................... 4 6.11 DDR2/mDDR Controller ........................... 102 1.4 Functional Block Diagram ............................ 5 6.12 Memory Protection Units .......................... 115 2 Revision History ......................................... 7 6.13 MMC / SD / SDIO (MMCSD0, MMCSD1) ......... 118 3 Device Overview ........................................ 8 6.14 Multichannel Audio Serial Port (McASP) .......... 121 3.1 Device Characteristics ............................... 8 6.15 Multichannel Buffered Serial Port (McBSP) ....... 130 3.2 Device Compatibility ................................. 9 6.16 Serial Peripheral Interface Ports (SPI0, SPI1) .... 140 3.3 ARM Subsystem ..................................... 9 6.17 Inter-Integrated Circuit Serial Ports (I2C) ......... 163 6.18 Universal Asynchronous Receiver/Transmitter 3.4 Memory Map Summary ............................. 12 (UART) ............................................ 167 3.5 Pin Assignments .................................... 15 6.19 Universal Serial Bus OTG Controller (USB0) 3.6 Pin Multiplexing Control ............................ 18 [USB2.0 OTG] ..................................... 169 3.7 Terminal Functions ................................. 19 6.20 LCD Controller (LCDC) ............................ 176 4 Device Configuration ................................. 56 6.21 Host-Port Interface (UHPI) ........................ 191 4.1 Boot Modes ......................................... 56 6.22 Universal Parallel Port (uPP) ...................... 199 6.23 Video Port Interface (VPIF) ....................... 204 4.2 SYSCFG Module ................................... 56 6.24 Enhanced Capture (eCAP) Peripheral ............ 210 4.3 Pullup/Pulldown Resistors .......................... 59 6.25 Enhanced High-Resolution Pulse-Width Modulator 5 Device Operating Conditions ....................... 60 (eHRPWM) ........................................ 213 5.1 Absolute Maximum Ratings Over Operating 6.26 Timers ............................................. 218 Junction Temperature Range 6.27 Real Time Clock (RTC) ........................... 220 (Unless Otherwise Noted) ................................. 60 6.28 General-Purpose Input/Output (GPIO) ............ 223 5.2 Recommended Operating Conditions .............. 61 6.29 Programmable Real-Time Unit Subsystem (PRUSS) 5.3 Electrical Characteristics Over Recommended ..................................................... 227 Ranges of Supply Voltage and Operating Junction 6.30 Emulation Logic ................................... 230 Temperature (Unless Otherwise Noted) ............ 63 7 Device and Documentation Support ............. 236 6 Peripheral Information and Electrical Specifications .......................................... 64 7.1 Device Support .................................... 236 6.1 Parameter Information .............................. 64 7.2 Documentation Support ........................... 236 6.2 Recommended Clock and Control Signal Transition 8 Mechanical Packaging and Orderable Behavior ............................................ 65 Information ............................................ 237 6.3 Power Supplies ..................................... 65 8.1 Device and Development-Support Tool 6.4 Reset ............................................... 66 Nomenclature ..................................... 237 6.5 Crystal Oscillator or External Clock Input .......... 69 8.2 Thermal Data for ZCE Package ................... 238 6.6 Clock PLLs ......................................... 70 8.3 Thermal Data for ZWT Package .................. 239 6 Contents Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AM1806 |
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