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www.ti.com SLES256 – MAY 2010 PACKAGE HEAT DISSIPATION RATINGS PARAMETER DRV8312 DRV8332 RqJC, junction-to-case (power pad / heat slug) 1.1 °C/W 0.9 °C/W thermal resistance This device is not intended to be used without a heatsink. Therefore, RqJA is not RqJA, junction-to-ambient thermal resistance 25 °C/W specified. See the Thermal Information section. Exposed power pad / heat slug area 34 mm2 80 mm2 PACKAGE POWER DERATINGS (DRV8312) (1) DERATING TA = 25°C FACTOR TA = 70°C POWER TA = 85°C POWER TA = 125°C POWER PACKAGE POWER ABOVE TA = RATING RATING RATING RATING 25°C 44-PIN TSSOP (DDW) 5.0 W 40.0 mW/°C 3.2 W 2.6 W 1.0 W (1) Based on EVM board layout MODE SELECTION PINS MODE PINS OUTPUT DESCRIPTION CONFIGURATION M3 M2 M1 1 0 0 1 3PH or 3 HB Three-phase or three half bridges with cycle-by-cycle current limit Three-phase or three half bridges with OC latching shutdown (no 1 0 1 1 3PH or 3 HB cycle-by-cycle current limit) 0 x x Reserved 1 1 x Reserved Copyright © 2010, Texas Instruments Incorporated 3 |
