TPS622310 datasheet(3/32 Pages) TI

Part #	TPS622310

Description	2 MHz / 3 MHz Ultra Small Step Down Converter in 1x1.5 SON Package

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Manufacturer	TI [Texas Instruments]

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TPS62230, TPS62231, TPS62232, TPS62233, TPS62234

TPS62235, TPS62236, TPS62237, TPS62238, TPS62239

TPS622310, TPS622311, TPS622312, TPS622313, TPS622314

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SLVS941C – APRIL 2009 – REVISED APRIL 2010

DISSIPATION RATINGS

(1)

POWER RATING

DERATING FACTOR

PACKAGE

RqJA

FOR TA ≤ 25°C

ABOVE TA = 25°C

1 × 1.5 SON

234°C/W(2)

420 mW

4.2 mW/°C

(1)

Maximum power dissipation is a function of TJ(max), qJA and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = [TJ(max) – TA] /qJA.

(2)

This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).

RECOMMENDED OPERATING CONDITIONS

operating ambient temperature TA = –40 to 85°C (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Supply voltage VIN

(2)

2.05

6

V

Effective inductance

2.2

mH

Effective capacitance

2.0

4.7

mF

VOUT ≤ VIN -1 V

(3)

500 mA maximum IOUT

(4)

3.0

3.6

Recommended minimum

350mA maximum IOUT

(5)

2.5

2.7

V

supply voltage

VOUT ≤ 1.8V

60 mA maximum output current(5)

2.05

Operating virtual junction temperature range, TJ

–40

125

°C

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (qJA), as given by the following equation: TA(max) = TJ(max) – (qJA × PD(max)).

(2)

The minimum required supply voltage for startup is 2.05 V. The part is functional down to the falling UVL (Under Voltage Lockout)

threshold.

(3)

For a voltage difference between minimum VIN and VOUT of ≥ 1 V

(4)

Typical value applies for TA = 25°C, maximum value applies for TA = 70°C with TJ ≤ 125°C, PCB layout needs to support proper thermal

performance.

(5)

Typical value applies for TA = 25°C, maximum value applies for TA = 85°C with TJ ≤ 125°C, PCB layout needs to support proper thermal

performance.

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