SURFACE MOUNT SILICON ZENDER DIODE

08/22/2007 Rev.1.00

www.SiliconStandard.com

1

PRODUCT SUMMARY

1.0 Watts Surface Mount

FEATURES

For surface mounted applications in order to

optimize board space

Low profile package

Built-in strain relief

Glass passivated junction

Low inductance

Typical IR less than 5.0uA above 11V

High temperature soldering guaranteed:

260

°C / 10 seconds at terminals

Plastic package has Underwriters Laboratory

Flammability Classification 94V-0

MECANICAL DATA

Case: Molded plastic over passivated junction

Terminals: Pure tin plated lead free,

solderable per MIL-STD-750, Method 2025

Polarity:Color Band denotes positive end

(cathode)

Standard packaging: 12mm tape (EIA-481)

Weight: 0.002 ounces, 0.064 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

(Ratings at 25

o

C ambient temperature unless otherwise specified.)

Type Number

Symbol

Value

Units

50

1.0

6.67

Watts

mW/

Peak Forward Surge Current, 8.3 ms Single Half

Sine-wave Superimposed on Rated Load

(JEDEC method)

( Note 2 )

10.0

Amps

Operating and Storage Temperature Range

-55 to + 150

Notes:

1. Mounted on 5.0mm

2. Measured on 8.3ms Single Half Sine-wave or Equivalent Square Wave, Duty Cycle=4 Pulses Per

Minute Maximum

Pb-free; RoHS-compliant

SMA/DO-214AC

Dimensions in inches and (millimeters)

1SMA4741 thru 1SMA200Z