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SG3846N Datasheet(PDF) 2 Page - Microsemi Corporation |
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SG3846N Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 10 page SG1846 Rev 1.1a Copyright © 1994 11861 Western Avenue ∞ ∞ ∞ ∞ ∞ Garden Grove, CA 92841 2 (714) 898-8121 ∞ ∞ ∞ ∞ ∞ FAX: (714) 893-2570 ABSOLUTE MAXIMUM RATINGS (Note 1 and 2) Sync Output Current ........................................................... 5mA Error Amplifier Output Current ............................................ 5mA Oscillator Charging current (Pin 9) ..................................... 5mA Operating Junction Temperature Hermetic (J, L, F Packages) ........................................ 150°C Plastic (N, DW Package) ............................................. 150°C Storage Temperature Range ............................ -65°C to 150°C Lead Temperature (Soldering, 10 Seconds) .................. 300°C Supply Voltage (+V IN ) .......................................................... 40V Collector Supply Voltage(V C) .............................................. 40V Analog Inputs (Pins 3, 4, 5, 6, & 16) ...................... -0.3V to +V IN Logic Input ........................................................... -0.3V to 5.5V Soure/Sink Load current (continuous) .......................... 200mA Source/Sink Load Current (peak, 200ns) ...................... 500mA Reference Load Current .................................................. 30mA Soft Start Sink Current ..................................................... 50mA Note 1. Values beyond which damage may occur. Note 2. Pin numbers refer to ceramic J package. THERMAL DATA J Package: Thermal Resistance-Junction to Case, θ JC .................. 30°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 80°C/W N Package: Thermal Resistance-Junction to Case, θ JC .................. 40°C/W Thermal Resistance-Junction to Ambient, θ JA ............. 65°C/W DW Package: Thermal Resistance-Junction to Case, θ JC ................... 40°C/W Thermal Resistance-Junction to Ambient, θ JA ............. 95°C/W F Package: Thermal Resistance-Junction to Case, θ JC .................. 70°C/W Thermal Resistance-Junction to Ambient, θ JA ........... 115°C/W L Package: Thermal Resistance-Junction to Case, θ JC .................. 35°C/W Thermal Resistance-Junction to Ambient, θ JA ........... 120°C/W Note A. Junction Temperature Calculation: T J = T A + (P D x θ JA ). Note B. The above numbers for θ JC are maximums for the limiting thermal resistance of the package in a standard mount- ing configuration. The θ JA numbers are meant to be guidelines for the thermal performance of the device/pc- board system. All of the above assume no ambient airflow. 5.10 5 3 0.4 100 5 -45 Reference Section T J = 25°C, IO = 1mA V IN = 8V to 40V I L = 1mA to 10mA Line, Load and Temperature 10Hz ≤ f ≤ 10KHz. T J = 25°C T J = 125°C, 1000Hrs. V REF = 0V 5.05 5.00 -10 Output Voltage Line Regulation Load Regulation Temperature Stability (Note 4) Total Output Variation (Note 4) Output Noise Voltage (Note 4) Long Term Stability (Note 4) Short Circuit Output Current Oscillator Timing Resistor (R T) ........................... 2KΩ to 100KΩ Oscillator Timing Capacitor (C T) .................... 1000 pF to 0.1µF Operating Ambient Temperature Range SG1846 ........................................................... -55°C to 125°C SG2846 ............................................................. -25°C to 85°C SG3846 ................................................................ 0°C to 70°C Note 3. Range over which the device is functiona l. RECOMMENDED OPERATING CONDITIONS (Note 3) Supply Voltage Range ............................................... 8V to 40V Collector Supply Voltage Range ............................. 4.5V to 40V Source/Sink Output Current (continuous) ...................... 100mA Source/Sink Output Current (peak 200ns) .................... 200mA Reference Load Current ........................................... 0 to 10mA Oscillator Frequency Range ........................... 1KHz to 500KHz ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1846/SG1847 with -55 °C ≤ T A ≤ 125°C, SG2846 with -25 °C ≤ T A ≤ 85 °C, SG3846 with 0°C ≤ T A ≤ 70 °C, +V IN = 15V. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Units SG1846 SG2846 SG3846 Parameter Test Conditions 5.15 20 15 5.20 5.00 4.95 -10 Min. Typ. Max. Min. Typ. Max. 5.10 5 3 0.4 100 5 -45 5.20 20 15 5.25 V mV mV mV/°C V µV mV mA RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.) .. 260° (+0, -5) |
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