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MAX97200BEWC+ Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX97200BEWC+ Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 13 page Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier 2 ______________________________________________________________________________________ Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PVIN or PVDD to PGND .......................................-0.3V to +2.2V GND to PGND ......................................................-0.3V to +0.3V PVSS to PGND .....................................................-2.2V to +0.3V OUT_ and IN_ to GND ............. (PVSS - 0.2V) to (PVDD + 0.2V) C1P, C1N ...................................................Cap connection only SHDN to GND .........................................................-0.3V to +4V Output Short-Circuit Current .....................................Continuous Thermal Limits (Note 1) Multiple Layer PCB Continuous Power Dissipation (TA = +70NC) 12-Bump WLP (derate 13.7mW/NC above +70NC)....1095mW 12-Bump WLP BJA.......................................................73NC/W 12-Bump WLP BCA ......................................................30NC/W Junction Temperature .....................................................+150NC Operating Temperature Range.......................... -40NC to +85NC Storage Temperature Range............................ -65NC to +150NC Bump Temperature (soldering) Reflow...........................+230NC ELECTRICAL CHARACTERISTICS (VPVIN = 1.8V, VPGND = VGND = 0V, VSHDN = 1.8V, C1 = C2 = C3 = 1FF, C4 = 10FF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Supply Voltage Range PVIN Guaranteed by PSRR 1.62 1.80 1.98 V UVLO Rising 1.48 1.58 V UVLO Falling 1.36 1.46 V Quiescent Supply Current IDD Inputs grounded, TA = +25NC, no load 1.15 1.7 mA 16I load, inputs grounded, TA = +25NC 1.16 Shutdown Current ISHDN VSHDN = 0V, TA = +25NC 0.2 F A Turn-On Time tON .6 1 ms CHARGE PUMP Oscillator Frequency fOSC1 VOUT = 0V, TA = +25NC 78 83 88 kHz Oscillator Frequency fOSC2 VOUT = 0.2V, RL = J, fIN = 1kHz 665 kHz Oscillator Frequency fOSC3 VOUT = 0.5V, RL = J, fIN = 1kHz 500 kHz Positive Output Voltage VPVDD VOUT = 0.2V, RL = J PVIN/2 V VOUT = 0.5V, RL = J PVIN Negative Output Voltage VPVSS VOUT = 0.2V, RL = J -PVIN/2 V VOUT = 0.5V, RL = J -PVIN Output Voltage Threshold VTH1 RL = J, output voltage at which the charge pump switches modes, VOUT rising, transition from 1/8 to normal frequency Q PVIN x 0.08 V Output Voltage Threshold VTH2 RL = J, output voltage at which the charge pump switches modes, VOUT rising, transition from high-efficiency mode to high-power mode Q PVIN x 0.24 V |
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