MAX97200 datasheet(2/13 Pages) MAXIM

Part #	MAX97200

Description	Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier

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Manufacturer	MAXIM [Maxim Integrated Products]

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Low-Power, Low-Offset, Dual Mode, Class H

DirectDrive Headphone Amplifier

2 ______________________________________________________________________________________

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PVIN or PVDD to PGND .......................................-0.3V to +2.2V

GND to PGND ......................................................-0.3V to +0.3V

PVSS to PGND .....................................................-2.2V to +0.3V

OUT_ and IN_ to GND ............. (PVSS - 0.2V) to (PVDD + 0.2V)

C1P, C1N ...................................................Cap connection only

SHDN to GND .........................................................-0.3V to +4V

Output Short-Circuit Current .....................................Continuous

Thermal Limits (Note 1)

Multiple Layer PCB

Continuous Power Dissipation (TA = +70NC)

12-Bump WLP (derate 13.7mW/NC above +70NC)....1095mW

12-Bump WLP BJA.......................................................73NC/W

12-Bump WLP BCA ......................................................30NC/W

Junction Temperature .....................................................+150NC

Operating Temperature Range.......................... -40NC to +85NC

Storage Temperature Range............................ -65NC to +150NC

Bump Temperature (soldering) Reflow...........................+230NC

ELECTRICAL CHARACTERISTICS

(VPVIN = 1.8V, VPGND = VGND = 0V, VSHDN = 1.8V, C1 = C2 = C3 = 1FF, C4 = 10FF, TA = TMIN to TMAX, unless otherwise noted.

Typical values are at TA = +25NC.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

Supply Voltage Range

PVIN

Guaranteed by PSRR

1.62

1.80

1.98

V

UVLO Rising

1.48

1.58

V

UVLO Falling

1.36

1.46

V

Quiescent Supply Current

IDD

Inputs grounded, TA = +25NC, no load

1.15

1.7

mA

16I load, inputs grounded, TA = +25NC

1.16

Shutdown Current

ISHDN

VSHDN = 0V, TA = +25NC

0.2

F

A

Turn-On Time

tON

.6

1

ms

CHARGE PUMP

Oscillator Frequency

fOSC1

VOUT = 0V, TA = +25NC

78

83

88

kHz

Oscillator Frequency

fOSC2

VOUT = 0.2V, RL = J, fIN = 1kHz

665

kHz

Oscillator Frequency

fOSC3

VOUT = 0.5V, RL = J, fIN = 1kHz

500

kHz

Positive Output Voltage

VPVDD

VOUT = 0.2V, RL = J

PVIN/2

V

VOUT = 0.5V, RL = J

PVIN

Negative Output Voltage

VPVSS

VOUT = 0.2V, RL = J

-PVIN/2

V

VOUT = 0.5V, RL = J

-PVIN

Output Voltage Threshold

VTH1

RL = J, output voltage at which the

charge pump switches modes, VOUT

rising, transition from 1/8 to normal

frequency

Q

PVIN

x

0.08

V

Output Voltage Threshold

VTH2

RL = J, output voltage at which the

charge pump switches modes, VOUT

rising, transition from high-efficiency

mode to high-power mode

Q

PVIN

x

0.24

V

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