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ADP2300/ADP2301 Rev. 0 | Page 23 of 28 CIRCUIT BOARD LAYOUT RECOMMENDATIONS Good circuit board layout is essential to obtain the best performance from the ADP2300/ADP2301. Poor layout can affect the regulation and stability, as well as the electromagnetic interface (EMI) and electromagnetic compatibility (EMC) performance. A PCB layout example is shown in Figure 50. Refer to the following guidelines for a good PCB layout: • Place the input capacitor, inductor, catch diode, output capacitor, and bootstrap capacitor close to the IC using short traces. • Ensure that the high current loop traces are as short and wide as possible. The high current path is shown in Figure 49. • Maximize the size of ground metal on the component side to improve thermal dissipation. • Use a ground plane with several vias connecting to the component side ground to further reduce noise inter- ference on sensitive circuit nodes. • Minimize the length of the FB trace connecting the top of the feedback resistive voltage divider to the output. In addition, keep these traces away from the high current traces and the switch node to avoid noise pickup. VIN BST SW FB EN GND ADP2300/ ADP2301 Figure 49. Typical Application Circuit with High Current Traces Shown in Blue INDUC TOR L1 C1 C2 C3 INPUT CA P BST CA P D1 CA TCH DIODE ADP2300/ADP2301 Figure 50. Recommended PCB Layout for the ADP2300/ADP2301 |
