LX1973B

Microsemi

Analog Mixed Signal Group

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 8

Automotive Light Sensor

TM

®

Copyright

© 2007

Rev. 1.3, 2008-01-11

PACKAGE DIMEN S IONS (CONTINUED)

Light Footprint

Active Area

Required Minimum Light footpri

Bonding / Wafer area

Recommended light footprint pattern

P2

L

C

Recommended

light foot print

P1

Minimum light

foot print

Dome Top Package

Dim

P1

1.8

0.070

P2

2.5

0.098

Note:

P2 represents a possible light footprint and its

dimensions are not subject to strict tolerances.

Only P1 is required to be covered with light. This

larger footprint is designed to ensure coverage of

the device’s active area.

Active Area

Required Minimum Light footprint

Bonding / Wafer area

Recommended light footprint pattern

P2

L

C

Recommended

light foot print

P1

Recommended

PCB Cutout

Minimum light

foot print

P3

Dome Bottom Package

Dim

P1

1.8

0.070

P2

2.5

0.098

P3

2.9

0.114

Note:

P2 represents a possible light footprint and its

dimensions are not subject to strict tolerances. Only

P1 is required to be covered with light. This larger

footprint is designed to ensure coverage of the

device’s active area.

P3 represents the minimum aperture through which

the dome of the device would fit in the PCB.

PRODUCTION DATA – Information contained in this document is proprietary to

Microsemi and is current as of publication date. This document may not be modified in

any way without the express written consent of Microsemi. Product processing does not

necessarily include testing of all parameters. Microsemi reserves the right to change the

configuration and performance of the product and to discontinue product at any time.