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ARF466FL Datasheet(PDF) 4 Page - Microsemi Corporation

Part # ARF466FL
Description  RF POWER MOSFETs N-CHANNEL ENHANCEMENT MODE
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

ARF466FL Datasheet(HTML) 4 Page - Microsemi Corporation

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ARF466FL
Thermal Considerations and Package Mounting:
The rated power dissipation is only available when the
package mounting surface is at 25°C and the junction tem-
perature is 175°C. The thermal resistance between junc-
tions and case mounting surface is 0.3°C/W. When instal-
led, an additional thermal impedance of 0.17°C/W between
the package base and the mounting surface is typical. In-
sure that the mounting surface is smooth and flat. Thermal
joint compound must be used to reduce the effects of small
surface irregularities. Use the minimum amount necessary
to coat the surface. The heatsink should incorporate a cop-
per heat spreader to obtain best results.
The package design clamps the ceramic base to the
heatsink. A clamped joint maintains the required mounting
pressure while allowing for thermal expansion of both the
base and the heat sink. Four 4-40 (M3) screws provide
the required mounting force. Torque the mounting screws
to 6 in-lb (0.68 N-m).
HAZARDOUS MATERIAL WARNING
The white ceramic portion of the device between leads and mounting surface is beryllium oxide, BeO. Beryllium oxide dust is toxic when inhaled. Care must be taken during
handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste.
.330
.210
.210
.325 +/- .01
.570
ARF466FL
1.500
.300
.200
.005
.040
.320
1.250
.125R
4 pls
.125dia
4 pls
T3 Package Outline
D
S
S
S
S
G
L1
C1
R1
R3
R4
R5
ARF466FL
L2
L3
C3
C4
C7
C6
R2
C2
C8
C9
L4
150V
+
-
RF
Output
RF
Input
40.68 MHz Test Circuit
+
-
Bias
0-12V
C5
TL1
C1 -- 2200pF ATC 700B
C2-C5 -- Arco 465 Mica trimmer
C6-C8 -- .1 mF 500V ceramic chip
C9 -- 3x 2200 pF 500V chips COG
L1 -- 3t #22 AWG .25"ID .25 "L ~55nH
L2 -- 5t #16 AWG .312" ID .35"L ~176nH
L3 -- 10t #24 AWG .25"ID ~.5uH
L4 -- VK200-4B ferrite choke 3uH
R1- R3 -- 1k
Ω 0.5W
R4- R5 -- 1
Ω 1W SMT
TL1 -- 40
Ω t-line 0.15 x 2"
C1 is ~1.75" from R4-5.
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. US and Foreign patents pending. All Rights Reserved.


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