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ARF466FL Datasheet(PDF) 4 Page - Microsemi Corporation |
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ARF466FL Datasheet(HTML) 4 Page - Microsemi Corporation |
4 / 4 page ARF466FL Thermal Considerations and Package Mounting: The rated power dissipation is only available when the package mounting surface is at 25°C and the junction tem- perature is 175°C. The thermal resistance between junc- tions and case mounting surface is 0.3°C/W. When instal- led, an additional thermal impedance of 0.17°C/W between the package base and the mounting surface is typical. In- sure that the mounting surface is smooth and flat. Thermal joint compound must be used to reduce the effects of small surface irregularities. Use the minimum amount necessary to coat the surface. The heatsink should incorporate a cop- per heat spreader to obtain best results. The package design clamps the ceramic base to the heatsink. A clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the base and the heat sink. Four 4-40 (M3) screws provide the required mounting force. Torque the mounting screws to 6 in-lb (0.68 N-m). HAZARDOUS MATERIAL WARNING The white ceramic portion of the device between leads and mounting surface is beryllium oxide, BeO. Beryllium oxide dust is toxic when inhaled. Care must be taken during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste. .330 .210 .210 .325 +/- .01 .570 ARF466FL 1.500 .300 .200 .005 .040 .320 1.250 .125R 4 pls .125dia 4 pls T3 Package Outline D S S S S G L1 C1 R1 R3 R4 R5 ARF466FL L2 L3 C3 C4 C7 C6 R2 C2 C8 C9 L4 150V + - RF Output RF Input 40.68 MHz Test Circuit + - Bias 0-12V C5 TL1 C1 -- 2200pF ATC 700B C2-C5 -- Arco 465 Mica trimmer C6-C8 -- .1 mF 500V ceramic chip C9 -- 3x 2200 pF 500V chips COG L1 -- 3t #22 AWG .25"ID .25 "L ~55nH L2 -- 5t #16 AWG .312" ID .35"L ~176nH L3 -- 10t #24 AWG .25"ID ~.5uH L4 -- VK200-4B ferrite choke 3uH R1- R3 -- 1k Ω 0.5W R4- R5 -- 1 Ω 1W SMT TL1 -- 40 Ω t-line 0.15 x 2" C1 is ~1.75" from R4-5. Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. US and Foreign patents pending. All Rights Reserved. |
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