APTGF15H120T1G

www.microsemi.com

3 – 6

Thermal and package characteristics

Symbol Characteristic

Min

Typ

Max

Unit

IGBT

0.9

Junction to Case Thermal Resistance

Diode

2

°C/W

RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz

2500

V

Operating junction temperature range

-40

150

Storage Temperature Range

-40

125

Operating Case Temperature

-40

100

°C

Torque Mounting torque

To heatsink

M4

2.5

4.7

N.m

Wt

Package Weight

80

g

Symbol Characteristic

Min

Typ

Max

Unit

Resistance @ 25°C

50

k

Ω

3952

K

























−

=

T

T

B

R

R

T

1

1

exp

25

85

/

25

25

See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com

T: Thermistor temperature